High-Performance CPU Air Cooler with Tower Heatsink & Silent Fan

280W TDP. Black Aluminium & Copper Tower. Ø 12 cm Fan. 800–2000 RPM PWM. 12V. Intel LGA 1150/1151/1155/1156/1200/1366/1700 & AMD AM4/AM5. Self-Assembly Kit Included. The High-Performance CPU Air Cooler for Every Current and Previous Generation Intel and AMD Platform.

The High-Performance CPU Air Cooler with Tower Heatsink and Silent Fan is a Black aluminium and copper tower air cooler with 280W TDP, a Ø 12 cm (120 mm) PWM fan operating between 800 and 2000 RPM at 12V via 4-pin connection, 12 cm width, 15.4 cm height, self-assembly kit included, sold as 1 unit in box packaging. Compatible with Intel LGA 1150, 1151, 1155, 1156, 1200, 1366 and 1700 and AMD AM4 and AM5. Nine CPU socket platforms covered by the included self-assembly mounting kit. 280W TDP covers the full thermal output of current-generation desktop CPUs including Intel Core i9 and AMD Ryzen 9 processors at their rated TDP specifications.

280W TDP + 800–2000 RPM PWM Fan + Aluminium & Copper Tower + 9-Platform Universal Compatibility: The Four Specifications That Define This as the Most Capable and Broadly Compatible CPU Air Cooler for Current and Previous Generation Desktop Builds.

The 280W TDP cooling capacity covers the full processor thermal design power of every current-generation mainstream and high-performance desktop CPU — Intel Core i9-14900K at 253W PL2, Intel Core i7 at 180W PL2, AMD Ryzen 9 7950X at 230W PPT and AMD Ryzen 7 at 142W PPT all falling within the 280W thermal dissipation capability of this tower cooler, meaning the cooler maintains safe CPU operating temperatures under sustained all-core load at maximum power draw without thermal throttle on any processor within those TDP parameters. The 800–2000 RPM PWM fan range provides the acoustic and thermal flexibility that different workload intensities require — the 4-pin PWM connection allowing the motherboard to set fan speed to 800 RPM at idle and light desktop loads where CPU heat generation is minimal and fan noise at 800 RPM is inaudible, and to ramp the Ø 12 cm fan to 2000 RPM at maximum airflow capacity when sustained CPU load raises temperatures to the level that requires increased airflow through the aluminium fin stack to maintain safe operating temperature. The aluminium and copper construction uses the thermal properties of both metals where each performs best in the heat transfer chain — copper at the direct heat pipe contact base where thermal conductivity is the priority and the temperature differential between the CPU IHS and the heat pipe fluid must be minimised, and aluminium in the fin stack where the large surface area-to-mass ratio of aluminium maximises the heat dissipation surface the 12 cm fan airflow contacts per gram of fin material. The 9-platform self-assembly kit includes every backplate, bracket, standoff and fastener required to mount the cooler on Intel LGA 1150, 1151, 1155, 1156, 1200, 1366 and 1700 and AMD AM4 and AM5 — covering the Intel 6th through 14th generation mainstream and HEDT platforms, the AMD Ryzen 1000 through 7000 series AM4 platforms and the AMD Ryzen 7000 series AM5 platform in a single included kit without requiring a separate bracket purchase for any listed socket.

Everything That Makes This Your Essential 280W Black Tower CPU Air Cooler for Intel and AMD Builds

• 280W TDP — covers Intel Core i9 and AMD Ryzen 9 at rated TDP, no throttle
• Ø 12 cm fan — 120 mm PWM, 800–2000 RPM, 4-pin motherboard header
• 800 RPM minimum — inaudible at idle and light desktop load
• 2000 RPM maximum — full airflow for sustained all-core gaming and workstation load
• Aluminium fin stack — maximum heat dissipation surface per gram of material
• Copper heat pipes — direct IHS contact, minimum thermal resistance
• Black — Black tower, Black fan frame, Black mounting hardware
• 15.4 cm height / 12 cm width — standard mid-tower case clearance compatible
• Intel LGA 1150 / 1151 / 1155 / 1156 — previous gen Intel mainstream compatible
• Intel LGA 1200 — 10th/11th gen Intel Core compatible
• Intel LGA 1366 — Intel Core X HEDT platform compatible
• Intel LGA 1700 — 12th/13th/14th gen Intel Core compatible
• AMD AM4 — Ryzen 1000–5000 series compatible
• AMD AM5 — Ryzen 7000 series compatible
• Self-assembly kit included — all hardware for all 9 platforms in box
• 12V / 4-pin PWM — standard motherboard CPU fan header connection

Because 280W TDP at 800 RPM Idle and 2000 RPM Maximum on a 120mm Fan That Fits Intel LGA 1150 Through LGA 1700 and AMD AM4 and AM5 With All Mounting Hardware Included Is Not a Cooler for One Build. It Is a Cooler for Every Build on Every Current-Generation Intel and AMD Platform.

Select the socket-specific backplate and bracket from the included self-assembly kit: Intel LGA 1700 for 12th–14th gen Core, LGA 1200 for 10th–11th gen, LGA 1151/1150/1155/1156 for 6th–9th gen, LGA 1366 for X-Series HEDT, or AMD AM5 for Ryzen 7000, AMD AM4 for Ryzen 1000–5000. Mount the backplate. Attach the bracket. Apply thermal paste to the CPU IHS. Lower the Black aluminium and copper tower — direct heat pipe contact on the IHS. Tighten to even pressure. Connect the 4-pin PWM cable to the CPU fan header at 12V. Boot. The motherboard PWM curve sets fan speed to 800 RPM at idle. Silent. Run the all-core stress test. The fan ramps to 2000 RPM. The aluminium fins dissipate the thermal load. The CPU temperature stabilises within the 280W TDP headroom. The clock speed holds. No throttle. 280W. 9 platforms. One self-assembly kit. Black tower. Installed.

Product Specifications